Duixian Liu; et al's Advanced millimeter-wave technologies : antennas, packaging PDF

By Duixian Liu; et al

ISBN-10: 047099617X

ISBN-13: 9780470996171

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5 that is tailored to fast prototyping and quick turnaround times, making the design of emerging technologies more robust against process variation, material losses and assembly tolerances. 1 Definition of Packaging The packaging of electronic components is a multidisciplinary task involving various sciences and technologies. Packaging involves physical, electrical, mechanical, and chemical engineering technologies, which creates a problem when defining packaging. Definitions can be quite complex depending on to whom you are talking.

Wave propagation inside the package is suppressed to provide a good RF isolation between functional units. This is either achieved by a chamber width and height below half the wavelength of the maximum frequency, or, by pieces of absorbing materials which are glued to the package, the lid or the substrates. The surface of the aluminum is gold plated to form a corrosion-resistant electrically conductive layer. The package is protected by a gold-plated aluminum lid for excellent shielding efficiency.

Reproduced by permission of © IBM. to integrate mmWave components in the same way as we have shrunk the size of cell phones and computer chips? Why are many of today’s mmWave systems still similar in size to those used a hundred years ago? 2, for instance, shows a photo of a bulky 60 GHz radio receiver that has been built from discrete components. The answer to this question is simple. First, one needs active devices that are fast enough to operate in the mmWave frequency range, and second, one has to be able monolithically to integrate many of them with their interconnects on a single die.

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Advanced millimeter-wave technologies : antennas, packaging and circuits by Duixian Liu; et al


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